IPC-JEDEC J-STD-609C.01-2024 电子组装用有铅/无铅端子成品材料的标识、符号与标签规范

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JOINT

INDUSTRY

STANDARD

Marking, Symbols, and

Labels of Leaded and

Lead-Free Terminal

Finished Materials Used in

Electronic Assembly

IPC/JEDEC J-STD-609C.01

April 2024

Supersedes:

IPC/JEDEC J-STD-609C December 2023

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Notice IPC and JEDEC Standards and Publications are designed to serve the public

interest through eliminating misunderstandings between manufacturers and

purchasers, facilitating interchangeability and improvement of products, and

assisting the purchaser in selecting and obtaining with minimum delay the

proper product for his particular need. Existence of such Standards and

Publications shall not in any respect preclude any member or nonmember of

IPC or JEDEC from manufacturing or selling products not conforming to

such Standards and Publications, nor shall the existence of such Standards

and Publications preclude their voluntary use by those other than IPC or

JEDEC members, whether the standard is to be used either domestically or

internationally.

Recommended Standards and Publications are adopted by IPC or JEDEC

without regard to whether their adoption may involve patents on articles,

materials, or processes. By such action, IPC or JEDEC do not assume any

liability to any patent owner, nor do they assume any obligation whatever

to parties adopting the Recommended Standard or Publication. Users are

also wholly responsible for protecting themselves against all claims of

liabilities for patent infringement. The material in this joint standard was

developed by the IPC Marking, Symbols and Labels for Identification of

Assemblies, Components and Devices Task Group (4-34b) of the Materials

Identification Subcommittee (4-34) and JEDEC Committee JC14.4 Quality

Processes and Methods.

Please use the Standard Improvement Form shown at the end of this

document.

or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited

and constitutes infringement under the Copyright Law of the United States.

For Technical Information Contact:

JEDEC

IPC

Solid State Technology Association

3000 Lakeside Drive, Suite 309S

3103 10th Street North, Suite 240S

Bannockburn, Illinois

Arlington, VA 22201

60015-1249

Tel 703 907.0026

Tel 847 615.7100

Fax 703.907.7583

Fax 847.615.7105

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IPC/JEDEC Joint Standard J-STD-609C.01

-i-

MARKING, SYMBOLS, AND LABELS OF LEADED AND LEAD-FREE TERMINAL

FINISHED MATERIALS USED IN ELECTRONIC ASSEMBLY

Contents

Page

Foreword ............................................................................................................................................ -iii-

1 Scope ..................................................................................................................................... 1

1.1 Purpose ................................................................................................................................... 1

2 Reference Documents ........................................................................................................... 2

2.1 IPC .......................................................................................................................................... 2

2.2 ANSI ........................................................................................................................................ 2

2.3 GEIA ....................................................................................................................................... 2

2.4 European Standards ............................................................................................................... 2

2.5 JEDEC .................................................................................................................................... 2

2.6 IEC .......................................................................................................................................... 2

2.7 European Parliament ............................................................................................................... 2

3 Terms and Definitions ........................................................................................................... 3

4 Symbols, Labels, and Marks ................................................................................................ 5

4.1 Material Category Symbol ....................................................................................................... 5

4.1.1 Size and Location .................................................................................................................... 5

4.1.2 Color ....................................................................................................................................... 5

4.1.3 Font ......................................................................................................................................... 5

4.2 Pb-free Symbol ....................................................................................................................... 5

4.3 Second (2nd) Level Interconnect Component Label ................................................................ 6

4.3.1 Size ......................................................................................................................................... 7

4.3.2 Color ....................................................................................................................................... 7

5 Marking/Labeling Categories ............................................................................................... 7

5.1 PCB Base Material Categories ................................................................................................ 7

5.1.1 Halogen-free Base Material ..................................................................................................... 7

5.2 PCB Surface Finish Categories ............................................................................................... 7

5.2.1 Pb-containing .......................................................................................................................... 7

5.2.2 Pb-free .................................................................................................................................... 8

5.3 Second (2nd) Level Interconnect Categories ............................................................................ 8

5.3.1 Pb-containing .......................................................................................................................... 8

5.3.2 Pb-free .................................................................................................................................... 8

5.4 Conformal Coating Categories ................................................................................................ 9

6 Component Marking and Labeling ....................................................................................... 9

6.1 Component Marking ................................................................................................................ 9

6.2 Lowest Level Shipping Container Labeling .............................................................................. 9

7 PCB/Assembly Marking and Labeling ............................................................................... 10

7.1 PCB Marking ......................................................................................................................... 10

7.1.1 PCB Shipping Container Labeling ......................................................................................... 10

7.2 Assembly Marking ................................................................................................................. 10

7.2.1 Assembly Shipping Container Labeling ................................................................................. 10

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标签： #电子组装 #印制电路板 #元器件

摘要：

IPC/JEDEC J-STD-609C.01 Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly是由国际电子工业联接协会IPC与固态技术协会JEDEC联合制定的规范，其内容包括端子材料（含铅、无铅）的标识方式（如文字、符号、颜色代码）；标签的内容要求（如材料类型、环保信息）；统一电子元器件端子材料的标识规则。适用于电子元器件生产、电子组装行业，指导企业对端子材料进行规范标识，保障电子制造过程的合规性与工艺准确性。

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IPC-JEDEC J-STD-609C.01-2024 电子组装用有铅/无铅端子成品材料的标识、符号与标签规范

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