JEDEC JESD22-A121A 锡及锡合金表面镀层晶须生长的测试方法

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JEDEC

STANDARD

Test Method for Measuring Whisker

Growth on Tin and Tin Alloy Surface

Finishes

JESD22-A121A

(Revision of JESD22-A121.01, December 2005)

JULY 2008

(Reaffirmed: MAY 2014, SEPTEMBER 2019)

JEDEC SOLID STATE TECHNOLOGY ASSOCIATION

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标签： #合金 #测试方法 #JEDEC

摘要：

JEDEC JESD22-A121A 是一项用于评估锡及锡合金表面镀层中晶须生长的标准化测试方法，由联合电子设备工程委员会（JEDEC）发布。该标准旨在通过加速环境应力测试，模拟电子元器件在实际使用过程中可能出现的锡晶须生长现象，从而评估镀层的长期可靠性与短路风险。测试方法通常包括在恒定温湿度条件下进行长时间存放，以及热循环等环境应力试验，并对样品表面进行显微观察与统计分析，以判断晶须的长度、密度及分布情况。该标准广泛适用于电子封装、连接器、引线框和印制电路板等含锡镀层组件的质量控制与可靠性验证

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JEDEC JESD22-A121A 锡及锡合金表面镀层晶须生长的测试方法

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