JEDEC JESD22-B112B 高温封装翘曲度测试方法

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JEDEC

STANDARD

Package Warpage Measurement of

Surface-Mount Integrated Circuits at

Elevated Temperature

JESD22-B112B

(Revision of JESD22-B112A, October 2009)

AUGUST 2018

JEDEC SOLID STATE TECHNOLOGY ASSOCIATION

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标签： #高温 #测试方法 #JEDEC

摘要：

本文详细介绍JEDEC标准JESD22-B112B中关于高温环境下封装翘曲度的测试方法，涵盖测试原理、设备要求、试样制备、温度曲线设定及翘曲度测量与数据分析流程。该标准适用于半导体封装在回流焊或可靠性测试过程中因热应力引起的形变评估，帮助工程师理解如何使用阴影莫尔条纹或激光扫描等技术精确测量翘曲量，从而优化封装设计与工艺参数，确保产品在高温工况下的结构稳定性与焊接可靠性。

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