JEDEC JESD22-B113B 手持电子产品组件互连可靠性特性的板级循环弯曲试验方法

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JEDEC

STANDARD

Board Level Cyclic Bend Test Method

for Interconnect Reliability

Characterization of SMT ICs for

Handheld Electronic Products

JESD22-B113B

(Revision of JESD22-B113A, September 2012)

AUGUST 2018

JEDEC SOLID STATE TECHNOLOGY ASSOCIATION

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标签： #试验方法 #特性 #JEDEC

摘要：

本文详细介绍JEDEC JESD22-B113B标准，该标准专门用于评估手持电子产品中组件互连（如焊点、BGA封装等）在反复机械弯曲应力下的可靠性特性。通过板级循环弯曲试验方法，模拟设备在日常使用中因握持、按压或意外跌落等导致的PCB板弯曲变形，从而量化分析互连接头的疲劳寿命、裂纹萌生及失效机制。该标准对于智能手机、平板电脑、可穿戴设备等便携式产品的可靠性设计与质量验证具有关键指导意义，能够帮助企业优化封装结构、选择合适材料并预判产品在实际工况中的使用寿命，确保在严苛机械环境下保持稳定的电气连接

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JEDEC JESD22-B113B 手持电子产品组件互连可靠性特性的板级循环弯曲试验方法

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