IPC 6015-1998

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IPC-6015

Qualiﬁcation and Performance

Speciﬁcation for Organic

Multichip Module (MCM-L)

Mounting and Interconnecting

Structures

ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES

2215 Sanders Road, Northbrook, IL 60062-6135

Tel. 847.509.9700 Fax 847.509.9798

www.ipc.org

IPC-6015

February 1998 A standard developed by IPC

The Principles of

Standardization In May 1995 the IPC’s Technical Activities Executive Committee adopted Principles of

Standardization as a guiding principle of IPC’s standardization efforts.

Standards Should:

• Show relationship to Design for Manufacturability

(DFM) and Design for Engineering (DFE)

• Minimize time to market

• Contain simple (simpliﬁed) language

• Just include spec information

• Focus on end product performance

• Include a feedback system on use and

problems for future improvement

Standards Should Not:

• Inhibit innovation

• Increase time-to-market

• Keep people out

• Increase cycle time

• Tell you how to make something

• Contain anything that cannot

be defended with data

Notice IPC Standards and Publications are designed to serve the public interest through eliminating

misunderstandings between manufacturers and purchasers, facilitating interchangeability and

improvement of products, and assisting the purchaser in selecting and obtaining with minimum

delay the proper product for his particular need. Existence of such Standards and Publications

shall not in any respect preclude any member or nonmember of IPC from manufacturing or sell-

ing products not conforming to such Standards and Publication, nor shall the existence of such

Standards and Publications preclude their voluntary use by those other than IPC members,

whether the standard is to be used either domestically or internationally.

Recommended Standards and Publications are adopted by IPC without regard to whether their

adoption may involve patents on articles, materials, or processes. By such action, IPC does

not assume any liability to any patent owner, nor do they assume any obligation whatever to

parties adopting the Recommended Standard or Publication. Users are also wholly responsible

for protecting themselves against all claims of liabilities for patent infringement.

IPC Position

Statement on

Specification

Revision Change

It is the position of IPC’s Technical Activities Executive Committee (TAEC) that the use and

implementation of IPC publications is voluntary and is part of a relationship entered into by

customer and supplier. When an IPC standard/guideline is updated and a new revision is pub-

lished, it is the opinion of the TAEC that the use of the new revision as part of an existing

relationship is not automatic unless required by the contract. The TAEC recommends the use

of the lastest revision. Adopted October 6. 1998

Why is there

a charge for

this standard?

Your purchase of this document contributes to the ongoing development of new and updated

industry standards. Standards allow manufacturers, customers, and suppliers to understand one

another better. Standards allow manufacturers greater efficiencies when they can set up their

processes to meet industry standards, allowing them to offer their customers lower costs.

IPC spends hundreds of thousands of dollars annually to support IPC’s volunteers in the

standards development process. There are many rounds of drafts sent out for review and

the committees spend hundreds of hours in review and development. IPC’s staff attends and

participates in committee activities, typesets and circulates document drafts, and follows all

necessary procedures to qualify for ANSI approval.

IPC’s membership dues have been kept low in order to allow as many companies as possible

to participate. Therefore, the standards revenue is necessary to complement dues revenue. The

price schedule offers a 50% discount to IPC members. If your company buys IPC standards,

why not take advantage of this and the many other beneﬁts of IPC membership as well? For

more information on membership in IPC, please visit www.ipc.org or call 847/790-5372.

Thank you for your continued support.

Any

copying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and

constitutes infringement under the Copyright Law of the United States.

IPC-6015

Qualification and

Performance Specification

for Organic Multichip

Module (MCM-L)

Mounting and

Interconnecting

Structures

Developed by the MCM-L Performance Task Group (D-33e) of the

Rigid Printed Board Committee of IPC

Users of this standard are encouraged to participate in the

development of future revisions.

Contact:

IPC

2215 Sanders Road

Northbrook, Illinois

60062-6135

Tel 847 509.9700

Fax 847 509.9798

ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES

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摘要：

IPC 6015-1998 是国际电子工业联接协会（IPC）发布的针对有机多层基板（MCM-L）的鉴定与性能规范标准。该标准主要定义了用于多芯片模块（MCM）的有机基板在制造、测试和可靠性评估方面的严格要求，涵盖了材料特性、电性能、热稳定性、机械强度以及环境适应性等关键指标。作为MCM-L基板行业的重要质量基准，IPC 6015-1998 为PCB制造商、封装设计者和终端产品用户提供了统一的验收规范和测试方法，确保基板在高温、高湿及温度循环等恶劣条件下仍能保持稳定性能。该标准对于推动高密度互连（

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IPC 6015-1998

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