IPC 9708-2010 印刷电路板组件（PCBA）焊盘cratering现象的测试方法规范

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Association Connecting Electronics Industries

IPC-9708

2010

Test Methods for

Characterization of

Printed Board Assembly

Pad Cratering

December 2010

A standard developed by IPC

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IPC-9708

Test Methods for

Characterization of

Printed Board Assembly

Pad Cratering

Developed by the SMT Attachment Reliability Test Methods Task

Group (6-10d) of the Product Reliability Committee (6-10) of IPC

Users of this publication are encouraged to participate in the

development of future revisions.

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标签： #电子制造行业 #Pad Cratering #PCB基材

摘要：

IPC-9708由国际电子工业联接协会发布，主要针对印刷电路板组件（PCBA）焊盘 cratering 现象的测试方法规范，规定了焊盘与 PCB 基材之间的分层/开裂失效（常见于机械应力、热应力作用下）的测试流程（如加载方式、测试设备）、数据采集与分析方法，用于评估 PCBA 焊盘的可靠性。适用于电子制造行业（如消费电子、汽车电子），指导企业测试 PCBA 焊盘的抗开裂能力，提升电子产品的机械/热可靠性。

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IPC 9708-2010 印刷电路板组件（PCBA）焊盘cratering现象的测试方法规范

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