IPC JEDEC J-STD-033D-2018 湿度/回流敏感性控制

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IPC/JEDEC J-STD-033D

April 2018

Supersedes IPC/JEDEC J-STD-033C-1

August 2014

Handling, Packing,

Shipping and

Use of Moisture,

Reﬂow, and Process

Sensitive Devices

JOINT

INDUSTRY

STANDARD

Notice

For Technical Information Contact:

JEDEC

Solid State Technology Association

3103 North 10th Street, Suite 240-S

Arlington, VA 22201-2107

Tel 703 907.0026

Fax 703 907.7501

IPC

3000 Lakeside Drive, Suite 105N

Bannockburn, Illinois

60015-1249

Tel 847 615.7100

Fax 847 615.7105

Please use the Standard Improvement Form shown at the end of this

document.

under both international and Pan-American copyright conventions. Any copying, scanning or other reproduction of these materials without

the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United

States.

JEDEC and IPC Standards and Publications are designed to serve the public

interest through eliminating misunderstandings between manufacturers and

purchasers, facilitating interchangeability and improvement of products,

and assisting the purchaser in selecting and obtaining with minimum delay

the proper product for his particular need. Existence of such Standards and

Publications shall not in any respect preclude any member or nonmember

of JEDEC or IPC from manufacturing or selling products not conforming

to such Standards and Publications, nor shall the existence of such Standards

and Publications preclude their voluntary use by those other than JEDEC

and IPC members, whether the standard is to be used either domestically

or internationally.

Recommended Standards and Publications are adopted by JEDEC and

IPC without regard to whether their adoption may involve patents on articles,

materials, or processes. By such action, JEDEC and IPC do not assume any

liability to any patent owner, nor do they assume any obligation whatever

to parties adopting the Recommended Standard or Publication. Users are also

wholly responsible for protecting themselves against all claims of liabilities

for patent infringement.

The material in this joint standard was developed by the JEDEC JC-14.1

Committee on Reliability Test Methods for Packaged Devices and the IPC

Plastic Chip Carrier Cracking Task Group (B-10a)

IPC/JEDEC J-STD-033D

Handling, Packing,

Shipping and Use of

Moisture, Reflow, and

Process Sensitive Devices

A joint standard developed by the JEDEC JC-14.1 Committee on

Reliability Test Methods for Packaged Devices and the B-10a Plastic

Chip Carrier Cracking Task Group of IPC

Users of this publication are encouraged to participate in the

development of future revisions.

Contact:

JEDEC

Solid State Technology Association

3103 North 10th Street, Suite 240-S

Arlington, VA 22201-2107

Tel 703 907.0026

Fax 703 907.7501

IPC

3000 Lakeside Drive, Suite 105 N

Bannockburn, Illinois

60015-1249

Tel 847 615.7100

Fax 847 615.7105

Supersedes:

IPC/JEDEC J-STD-033C-1 -

August 2014

IPC/JEDEC J-STD-033C -

February 2012

IPC/JEDEC J-STD-033B.1

includes Amendment 1 -

January 2007

IPC/JEDEC J-STD-033B -

October 2005

IPC/JEDEC J-STD-033A -

July 2002

IPC/JEDEC J-STD-033 -

April 1999

JEDEC JEP124

IPC-SM-786A -January 1995

IPC-SM-786 - December 1990

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摘要：

IPC JEDEC J-STD-033D-2018聚焦于电子元器件的湿度 / 回流敏感性控制等相关要求，为电子行业在元器件存储、处理及装配过程中应对湿度和回流焊接环境的可靠性提供规范。

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