IPC JEDEC J-STD-035A-2022

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IPC/JEDEC J-STD-035A

Acoustic Microscopy for

Non-Hermetic Encapsulated

Electronic Devices

A joint standard developed by the B-10a IPC Plastic Chip Carrier

Cracking Task Group and the JEDEC JC-14.1 Committee on Reliability

Test Methods for Packaged Devices

December 2022

Supersedes:

IPC/JEDEC J-STD-035

April 1999

Users of this standard are encouraged to participate in the development

of future revisions.

Contact:

JEDEC IPC

Solid State Technology Association 3000 Lakeside Drive

3103 North 10th Street Suite 309S

Suite 240-South Bannockburn, IL 60015-1249

Arlington, VA 22201-2107 Tel 847 615.7100

Tel 703 907.0026 Fax 847 615.7105

Fax 703 907.7501

NOTICE

JEDEC standards and publications contain material that has been prepared, reviewed, and

approved through the JEDEC Board of Directors level and subsequently reviewed and approved

by the JEDEC legal counsel.

JEDEC standards and publications are designed to serve the public interest through eliminating

misunderstandings between manufacturers and purchasers, facilitating interchangeability and

improvement of products, and assisting the purchaser in selecting and obtaining with minimum

delay the proper product for use by those other than JEDEC members, whether the standard is to

be used either domestically or internationally.

JEDEC standards and publications are adopted without regard to whether or not their adoption

may involve patents or articles, materials, or processes. By such action JEDEC does not assume

any liability to any patent owner, nor does it assume any obligation whatever to parties adopting

the JEDEC standards or publications.

The information included in JEDEC standards and publications represents a sound approach to

product specification and application, principally from the solid state device manufacturer

viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or

publication may be further processed and ultimately become an ANSI standard.

No claims to be in conformance with this standard may be made unless all requirements stated in

the standard are met.

Inquiries, comments, and suggestions relative to the content of this JEDEC standard or

publication should be addressed to JEDEC at the address below, or refer to www.jedec.org under

Standards and Documents for alternative contact information.

Published by

©JEDEC Solid State Technology Association 2022

3103 North 10th Street

Suite 240 South

Arlington, VA 22201-2107

This document may be downloaded free of charge; however JEDEC retains the

charge for or resell the resulting material.

PRICE: Contact JEDEC

Printed in the U.S.A.

PLEASE!

DON’T VIOLATE

THE

LAW!

This document is copyrighted by JEDEC and may not be

reproduced without permission.

For information, contact:

JEDEC Solid State Technology Association

3103 North 10th Street

Suite 240 South

Arlington, VA 22201-2107

or refer to www.jedec.org under Standards-Documents/Copyright Information.

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摘要：

IPC JEDEC J-STD-035A-2022 是电子行业权威标准，专注于评估非密封固态表面贴装器件（SMD）在回流焊接过程中的湿气敏感度等级（MSL）。该标准替代了旧版J-STD-035，提供了最新的分类方法、预处理条件、测试流程以及可靠性判据，旨在预防因湿气吸收引发的“爆米花效应”——即焊接高温下内部水分膨胀导致的器件开裂或分层。适用于无铅和有铅焊接工艺，以及潮湿敏感等级从1级到5a级的各类集成电路和分立器件。通过遵循J-STD-035A，电子产品制造商可以确保元器件的长期可靠性，优化仓

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IPC JEDEC J-STD-035A-2022

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