IPC JPCA 2315-2000

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IPC/JPCA-2315

Design Guide for High

Density Interconnects (HDI)

and Microvias

ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES

2215 Sanders Road, Northbrook, IL 60062-6135

Tel. 847.509.9700 Fax 847.509.9798

www.ipc.org

IPC/JPCA-2315

June 2000 A standard developed by IPC and JPCA

The Principles of

Standardization In May 1995 the IPC’s Technical Activities Executive Committee adopted Principles of

Standardization as a guiding principle of IPC’s standardization efforts.

Standards Should:

• Show relationship to Design for Manufacturability

(DFM) and Design for the Environment (DFE)

• Minimize time to market

• Contain simple (simpliﬁed) language

• Just include spec information

• Focus on end product performance

• Include a feedback system on use and

problems for future improvement

Standards Should Not:

• Inhibit innovation

• Increase time-to-market

• Keep people out

• Increase cycle time

• Tell you how to make something

• Contain anything that cannot

be defended with data

Notice IPC Standards and Publications are designed to serve the public interest through eliminating

misunderstandings between manufacturers and purchasers, facilitating interchangeability and

improvement of products, and assisting the purchaser in selecting and obtaining with minimum

delay the proper product for his particular need. Existence of such Standards and Publications

shall not in any respect preclude any member or nonmember of IPC from manufacturing or sell-

ing products not conforming to such Standards and Publication, nor shall the existence of such

Standards and Publications preclude their voluntary use by those other than IPC members,

whether the standard is to be used either domestically or internationally.

Recommended Standards and Publications are adopted by IPC without regard to whether their

adoption may involve patents on articles, materials, or processes. By such action, IPC does

not assume any liability to any patent owner, nor do they assume any obligation whatever to

parties adopting the Recommended Standard or Publication. Users are also wholly responsible

for protecting themselves against all claims of liabilities for patent infringement.

IPC Position

Statement on

Specification

Revision Change

It is the position of IPC’s Technical Activities Executive Committee (TAEC) that the use and

implementation of IPC publications is voluntary and is part of a relationship entered into by

customer and supplier. When an IPC standard/guideline is updated and a new revision is pub-

lished, it is the opinion of the TAEC that the use of the new revision as part of an existing

relationship is not automatic unless required by the contract. The TAEC recommends the use

of the lastest revision. Adopted October 6. 1998

Why is there

a charge for

this standard?

Your purchase of this document contributes to the ongoing development of new and updated

industry standards. Standards allow manufacturers, customers, and suppliers to understand one

another better. Standards allow manufacturers greater efficiencies when they can set up their

processes to meet industry standards, allowing them to offer their customers lower costs.

IPC spends hundreds of thousands of dollars annually to support IPC’s volunteers in the

standards development process. There are many rounds of drafts sent out for review and

the committees spend hundreds of hours in review and development. IPC’s staff attends and

participates in committee activities, typesets and circulates document drafts, and follows all

necessary procedures to qualify for ANSI approval.

IPC’s membership dues have been kept low in order to allow as many companies as possible

to participate. Therefore, the standards revenue is necessary to complement dues revenue. The

price schedule offers a 50% discount to IPC members. If your company buys IPC standards,

why not take advantage of this and the many other beneﬁts of IPC membership as well? For

more information on membership in IPC, please visit www.ipc.org or call 847/790-5372.

Thank you for your continued support.

Any

copying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and

constitutes infringement under the Copyright Law of the United States.

IPC/JPCA-2315

Design Guide for High

Density Interconnects

(HDI) and Microvias

Developed by the High Density Interconnect (HDI) Design

Subcommittee (D-41) of the High Density Interconnect (HDI)

Committee (D-40) of IPC and the Build-Up PWB Committee of

the Japan Printed Circuit Association (JPCA)

Users of this standard are encouraged to participate in the

development of future revisions.

Contact:

IPC

2215 Sanders Road

Northbrook, Illinois

60062-6135

Tel 847 509.9700

Fax 847 509.9798

ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES

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摘要：

IPC JPCA 2315-2000 是国际电子工业联接协会（IPC）与日本电子电路工业协会（JPCA）联合发布的一项关键性电子行业标准，主要针对高密度互连（HDI）印刷电路板的设计与制造规范。该标准于2000年正式发布，旨在为FR-4基材、微导通孔技术、激光钻孔工艺及细线宽距设计提供统一的技术基准，适用于移动设备、汽车电子及航空航天等对小型化、高性能要求严苛的领域。通过遵循IPC JPCA 2315-2000，企业可确保PCB产品在电气性能、热可靠性及可制造性方面达到国际公认的质量水平，同时优

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IPC JPCA 2315-2000

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