IPC J-STD-003D-2022 印制板的可焊性测试

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IPC J-STD-003D

October 2022

Supersedes IPC-J-STD-003C

WAM 1 and 2

September 2017

Solderability Tests for

Printed Boards

JOINT

INDUSTRY

STANDARD

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About IPC

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IPC-J-STD-003D

Developed by the Printed Circuit Board Solderability Specifications

Task Group (5-23a) of the Assembly and Joining Committee (5-20)

of IPC

Solderability

Tests for

Printed Boards

Supersedes:

J-STD-003C WAM 1 and 2 -

September 2017

J-STD-003C - September 2013

J-STD-003B - March 2007

J-STD-003A - February 2003

J-STD-003 - April 1992

IPC-S-804A - January 1987

IPC-S-803

IPC-S-801

Users of this publication are encouraged to participate in the

development of future revisions.

Contact:

IPC

3000 Lakeside Drive, Suite 105 N

Bannockburn, IL

60015-1249

Tel 847 615.7100

Fax 847 615.7105

Association Connecting Electronics Industries

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摘要：

IPC J-STD-003D-2022是一项联合行业标准，聚焦于印制板的可焊性测试。可焊性测试是电子制造领域的关键环节，用于确保印制板能够在焊接工艺中与电子元件可靠连接，保障电子设备的性能和稳定性。

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IPC J-STD-003D-2022 印制板的可焊性测试

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