IPC SG-141-1992

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Carl 2024-09-01 38 151.48KB 20 页 22星币
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IPC-SG-141
Specification for Finished
Fabric Woven From ‘‘S’
Glass for Printed Boards
IPC-SG-141
Original Publication - February 1992
The Institute for
Interconnecting
and Packaging
Electronic Circuits
A standard developed by the Institute for Interconnecting
and Packaging Electronic Circuits
2215 Sanders Road
Northbrook, Illinois
60062-6135
Tel
Fax
URL:
847 509.9700
847 509.9798
http://www.ipc.org
Standardization In May 1995 the IPC’s Technical Activities Executive Committee adopted Prin-
ciples of Standardization as a guiding principle of IPC’s standardization efforts
Standards Should:
Show relationship to DFM & DFE
Minimize time to market
Contain simple (simplified) language
Just include spec information
Focus on end product performance
Include a feed back system on use and problems for future improvement
Standards Should Not:
• Inhibit innovation
• Increase time-to-market
Keep people out
Increase cycle time
Tell you how to make something
Contain anything that cannot be defended with data
Notice IPC Standards and Publications are designed to serve the public interest through
eliminating misunderstandings between manufacturers and purchasers, facilitat-
ing interchangeability and improvement of products, and assisting the pur-
chaser in selecting and obtaining with minimum delay the proper product for
his particular need. Existence of such Standards and Publications shall not
in any respect preclude any member or nonmember of IPC from manufacturing
or selling products not conforming to such Standards and Publication, nor
shall the existence of such Standards and Publications preclude their voluntary
use by those other than IPC members, whether the standard is to be used
either domestically or internationally.
Recommended Standards and Publications are adopted by IPC without regard to
whether their adoption may involve patents on articles, materials, or processes.
By such action, IPC does not assume any liability to any patent owner, nor
do they assume any obligation whatever to parties adopting the Recommended
Standard or Publication. Users are also wholly responsible for protecting
themselves against all claims of liabilities for patent infringement.
The material in this standard was developed by the Glass Technology Task
Group of the Laminate Raw Materials Subcommittee of the Base Materials
Committee of the Institute for Interconnecting and Packaging Electronic
Circuits.
Copyright © 1996 by the Institute for Interconnecting and Packaging Electronic Circuits. All rights reserved. Published 1996. Printed in the
United States of America.
No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission
of the publisher. 1996
IPC-SG-141
Specification for Finished
Fabric Woven from ‘‘S’’
Glass for Printed Boards
Developed by the Glass Technology Task Group of the Laminate Raw
Materials Subcommittee of the Base Materials Committee of the Institute
for Interconnecting and Packaging Electronic Circuits
Users of this standard are encouraged to participate in the
development of future revisions.
Contact:
IPC
2215 Sanders Road
Northbrook, Illinois
60062-6135
Tel 847 509.9700
Fax 847 509.9798
T
HE
I
NSTITUTE FOR
I
NTERCONNECTING
AND
P
ACKAGING
E
LECTRONIC
C
IRCUITS
摘要:

IPC SG-141-1992 是美国电子电路与电子互连行业协会(IPC)发布的一项关于印制板焊料涂层标准的技术规范文档,主要规定了印制电路板(PCB)表面焊料涂覆材料的性能要求、测试方法以及质量控制指标,适用于电子组装行业中涉及热风整平(HASL)、浸焊和滚焊等焊料涂覆工艺的制造与验收过程。该标准涵盖了焊料成分、涂层厚度、润湿性、均匀性及可焊性等关键参数,旨在确保电子元器件的可靠连接与长期使用稳定性。IPC SG-141-1992 作为行业内早期的重要参考文件,为后续更严苛的无铅焊料规范和环境

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作者:Carl 分类:国外协会 价格:22星币 属性:20 页 大小:151.48KB 格式:PDF 时间:2024-09-01

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