IPC TF-870-1989

VIP专免

Carl 2024-09-01 11 250.02KB 30 页 22星币

侵权投诉

IPC-TF-870

Qualiﬁcation and

Performance of Polymer

Thick Film Printed Boards

ANSI/IPC-TF-870

November 1989

The Institute for

Interconnecting

and Packaging

Electronic Circuits

A standard developed by the Institute for Interconnecting

and Packaging Electronic Circuits

2215 Sanders Road

Northbrook, Illinois

60062-6135

Tel

Fax

URL:

847 509.9700

847 509.9798

http://www.ipc.org

Standardization In May 1995 the IPC’s Technical Activities Executive Committee adopted Prin-

ciples of Standardization as a guiding principle of IPC’s standardization efforts.

Standards Should:

• Show relationship to DFM & DFE

• Minimize time to market

• Contain simple (simpliﬁed) language

• Just include spec information

• Focus on end product performance

• Include a feed back system on use and problems for future improvement

Standards Should Not:

• Inhibit innovation

• Increase time-to-market

• Keep people out

• Increase cycle time

• Tell you how to make something

• Contain anything that cannot be defended with data

Notice IPC Standards and Publications are designed to serve the public interest through

eliminating misunderstandings between manufacturers and purchasers, facilitat-

ing interchangeability and improvement of products, and assisting the pur-

chaser in selecting and obtaining with minimum delay the proper product for

his particular need. Existence of such Standards and Publications shall not

in any respect preclude any member or nonmember of IPC from manufacturing

or selling products not conforming to such Standards and Publication, nor

shall the existence of such Standards and Publications preclude their voluntary

use by those other than IPC members, whether the standard is to be used

either domestically or internationally.

Recommended Standards and Publications are adopted by IPC without regard to

whether their adoption may involve patents on articles, materials, or processes.

By such action, IPC does not assume any liability to any patent owner, nor

do they assume any obligation whatever to parties adopting the Recommended

Standard or Publication. Users are also wholly responsible for protecting

themselves against all claims of liabilities for patent infringement.

The material in this standard was developed by the Polymer Thick Film Task

Group of the Hybrid & Related Technologies Committee of the Institute for

Interconnecting and Packaging Electronic Circuits.

United States of America.

No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission

of the publisher. 1996

ANSI/IPC-TF-870

Qualification and

Performance of Polymer

Thick Film Printed Boards

Developed by the Polymer Thick Film Task Group of the Hybrid &

Related Technologies Committee of the Institute for Interconnecting

and Packaging Electronic Circuits

Users of this standard are encouraged to participate in the

development of future revisions.

Contact:

IPC

2215 Sanders Road

Northbrook, Illinois

60062-6135

Tel 847 509.9700

Fax 847 509.9798

NSTITUTE FOR

NTERCONNECTING

AND

ACKAGING

LECTRONIC

IRCUITS

文档加载中……请稍候！
如果长时间未打开，您也可以点击刷新试试。

下载文档到电脑，查找使用更方便

亲，本站95%以上的标准规范都面向会员免费，办理VIP会员下载更省钱，平均每篇不到2元

立即下载 VIP免费下载

摘要：

IPC TF-870-1989 是由国际电子工业联接协会（IPC）发布的关于电子组装用焊膏的规格与验收标准规范文档。该标准主要定义了焊膏的成分、金属含量、粘度、粉末粒度分布、助焊剂活性等级以及保质期等关键技术参数，并提供了相应的测试方法和验收标准。作为电子制造行业中早期对焊膏进行系统化规范的重要文件，IPC TF-870-1989 为SMT（表面贴装技术）工艺中的印刷、回流焊等环节提供了可靠的质量控制依据。虽然随着技术进步，该标准后续已被IPC J-STD-005系列标准所取代，但理解IPC T

展开>> 收起<<

IPC TF-870-1989.pdf

共30页,预览4页

还剩页未读，继续阅读

声明：本文档系会员上传，若文档所含内容侵犯了您的版权或隐私，请立即通知，我们立即给予侵权申诉删除！

IPC TF-870-1989

相关推荐

开通VIP享超值会员特权

相关内容

热门标签

举报选择: