JEDEC IPC JP002-2006

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JEDEC/IPC

JOINT PUBLICATION

Current Tin Whiskers Theory and

Mitigation Practices Guideline

JP002

MARCH 2006

JEDEC SOLID STATE TECHNOLOGY ASSOCIATION

IPC ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES®

NOTICE

JEDEC and IPC Standards and Publications are designed to serve the public interest through

eliminating misunderstandings between manufacturers and purchasers, facilitating

interchangeability and improvement of products, and assisting the purchaser in selecting and

obtaining with minimum delay the proper product for his particular need. Existence of such

Standards and Publications shall not in any respect preclude any member or nonmember of

JEDEC or IPC from manufacturing or selling products not conforming to such Standards and

Publications, nor shall the existence of such Standards and Publications preclude their voluntary

use by those other than JEDEC and IPC members, whether the standard is to be used either

domestically or internationally.

Recommended Standards and Publications are adopted by JEDEC and IPC without regard to

whether their adoption may involve patents on articles, materials, or processes. By such action,

JEDEC and IPC do not assume any liability to any patent owner, nor do they assume any

obligation whatever to parties adopting the Recommended Standard or Publication. Users are

also wholly responsible for protecting themselves against all claims of liabilities for patent

infringement.

The material in this joint standard was developed by the

JEDEC JC-14.1 Committee on Reliability Test Methods for Packaged Devices

and the IPC Tin Whiskers Guideline Task Group (5-23e).

For Technical Information Contact:

JEDEC Solid State Technology Association

2500 Wilson Boulevard, Suite 220

Arlington, VA 22201

Phone (703) 907-7500

Fax (703) 907-7583

IPC

3000 Lakeside Drive, Suite 309S

Bannockburn, Illinois 60015-1219

Tel (847) 615-7100

Fax (847) 615-7105

conventions. Any copying, scanning or other reproduction of these materials without the prior

written consent of the copyright holder is strictly prohibited and constitutes infringement under

the Copyright Law of the United States.

This document may be downloaded free of charge at www.jedec.org; however JEDEC/IPC retains the

agrees not to charge for or resell the resulting material.

Printed in the U.S.A.

PLEASE!

DON’T VIOLATE

THE

LAW!

This document is copyrighted by JEDEC and IPC and may not be

reproduced without permission.

Organizations may obtain permission to reproduce a limited number of copies

through entering into a license agreement. For information, contact:

JEDEC Solid State Technology Association

2500 Wilson Boulevard

Arlington, Virginia 22201-3834

or call (703) 907-7559

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摘要：

JEDEC IPC JP002-2006 是一份由 JEDEC 和 IPC 两大国际权威组织联合发布的电子行业标准规范文档，专注于印刷电路板（PCB）与电子组装的可靠性评估和测试方法。该标准旨在为电子制造商、设计工程师和品质管控人员提供统一的指导框架，涵盖材料选择、工艺控制与失效分析等关键环节，帮助企业在产品开发与生产过程中有效降低风险、提升产品长期稳定性与使用寿命。遵循 JP002-2006 规范，不仅有助于满足国际客户对高品质电子产品的需求，还能在搜索引擎优化（SEO）中精准吸引从事 PCB

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