IPC 2251-2003

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IPC-2251

Design Guide for the

Packaging of High Speed

Electronic Circuits

ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES

2215 Sanders Road, Northbrook, IL 60062-6135

Tel. 847.509.9700 Fax 847.509.9798

www.ipc.org

IPC-2251

November 2003 A standard developed by IPC

Supersedes IPC-D-317A

January 1995

The Principles of

Standardization In May 1995 the IPC’s Technical Activities Executive Committee adopted Principles of

Standardization as a guiding principle of IPC’s standardization efforts.

Standards Should:

• Show relationship to Design for Manufacturability

(DFM) and Design for the Environment (DFE)

• Minimize time to market

• Contain simple (simpliﬁed) language

• Just include spec information

• Focus on end product performance

• Include a feedback system on use and

problems for future improvement

Standards Should Not:

• Inhibit innovation

• Increase time-to-market

• Keep people out

• Increase cycle time

• Tell you how to make something

• Contain anything that cannot

be defended with data

Notice IPC Standards and Publications are designed to serve the public interest through eliminating mis-

understandings between manufacturers and purchasers, facilitating interchangeability and improve-

ment of products, and assisting the purchaser in selecting and obtaining with minimum delay the

proper product for his particular need. Existence of such Standards and Publications shall not in

any respect preclude any member or nonmember of IPC from manufacturing or selling products

not conforming to such Standards and Publication, nor shall the existence of such Standards and

Publications preclude their voluntary use by those other than IPC members, whether the standard

is to be used either domestically or internationally.

Recommended Standards and Publications are adopted by IPC without regard to whether their adop-

tion may involve patents on articles, materials, or processes. By such action, IPC does not assume

any liability to any patent owner, nor do they assume any obligation whatever to parties adopting

the Recommended Standard or Publication. Users are also wholly responsible for protecting them-

selves against all claims of liabilities for patent infringement.

IPC Position

Statement on

Specification

Revision Change

It is the position of IPC’s Technical Activities Executive Committee (TAEC) that the use and

implementation of IPC publications is voluntary and is part of a relationship entered into by

customer and supplier. When an IPC publication is updated and a new revision is published, it

is the opinion of the TAEC that the use of the new revision as part of an existing relationship

is not automatic unless required by the contract. The TAEC recommends the use of the latest

revision. Adopted October 6. 1998

Why is there

a charge for

this document?

Your purchase of this document contributes to the ongoing development of new and updated industry

standards and publications. Standards allow manufacturers, customers, and suppliers to understand

one another better. Standards allow manufacturers greater efficiencies when they can set up their

processes to meet industry standards, allowing them to offer their customers lower costs.

IPC spends hundreds of thousands of dollars annually to support IPC’s volunteers in the standards

and publications development process. There are many rounds of drafts sent out for review and

the committees spend hundreds of hours in review and development. IPC’s staff attends and par-

ticipates in committee activities, typesets and circulates document drafts, and follows all necessary

procedures to qualify for ANSI approval.

IPC’s membership dues have been kept low to allow as many companies as possible to participate.

Therefore, the standards and publications revenue is necessary to complement dues revenue. The

price schedule offers a 50% discount to IPC members. If your company buys IPC standards and

publications, why not take advantage of this and the many other beneﬁts of IPC membership as

well? For more information on membership in IPC, please visit www.ipc.org or call 847/790-5372.

Thank you for your continued support.

Any copying,

scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes

infringement under the Copyright Law of the United States.

IPC-2251

Design Guide for the

Packaging of High Speed

Electronic Circuits

Developed by the IPC-2251 Task Group (D-21a) of the High Speed/

High Frequency Committee (D-20) of IPC

Users of this publication are encouraged to participate in the

development of future revisions.

Contact:

IPC

2215 Sanders Road

Northbrook, Illinois

60062-6135

Tel 847 509.9700

Fax 847 509.9798

Supersedes:

IPC-D-317A - January 1995

IPC-D-317 - April 1990

ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES

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摘要：

IPC 2251-2003是由国际电子工业联接协会（IPC）发布的关于射频与微波电路设计中阻抗计算与建模的标准，适用于高速数字与射频电路板的信号完整性设计。该标准主要提供了基于传输线理论（如微带线、带状线等）的阻抗计算公式、模型验证方法以及材料参数（如介电常数、损耗角正切）对阻抗影响的指导。对于PCB设计工程师和射频工程师而言，IPC 2251-2003是确保高频信号传输质量、避免信号反射和插入损耗的关键参考文档，尤其在5G通信、雷达系统及高速背板设计中具有重要应用价值。

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IPC 2251-2003

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