IPC 7091A-2023

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IPC-7091A

2023 - January

Design and Assembly Process

Implementation of 3D Components

Supersedes IPC-7091

June 2017

An international standard developed by IPC

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IPC Mission

About IPC

Standards

IPC Position

Statement on

Specication

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Standards

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IPC is a global trade association dedicated to furthering the competitive excellence and nancial

success of its members, who are participants in the electronics industry.

In pursuit of these objectives, IPC will devote resources to management improvement and

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IPC-7091A

Developed by the 3D Electronic Packages Guideline Task Group (B-11a)

of the Packaged Electronic Components Committee (B-10) of IPC

Design and Assembly

Process Implementation

of 3D Components

Supersedes:

IPC-7091 - June, 2017

Users of this publication are encouraged to

participate in the development of future revisions.

Contact:

IPC

3000 Lakeside Drive, Suite 105 N

Bannockburn, Illinois

60015-1249

Tel 847 615.7100

Fax 847 615.7105

Association Connecting Electronics Industries

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摘要：

IPC 7091A-2023 是国际电子工业联接协会（IPC）于2023年发布的关于三维（3D）电子组件及异构集成设计、组装与可靠性评估的最新标准。该标准旨在为工程师和制造商提供针对3D堆叠封装、系统级封装（SiP）以及复杂高密度互连结构的焊点质量检测、失效分析和可靠性测试的权威指南。相比之前的版本，IPC 7091A-2023 更新了基于X射线和超声波的无损检测方法，并强化了对微焊点、底部填充材料和热机械应力下的寿命预测要求。对于从事先进封装、物联网（IoT）设备及高性能计算硬件的企业而言，遵

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IPC 7091A-2023

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