IPC 7526A-2022

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IPC-7526A
2022 - March
Stencil and Misprinted Board
Cleaning Handbook
Supersedes IPC-7526
February 2007
An international standard developed by IPC
©Copyright 2022. IPC International, Bannockburn, Illinois. All rights reserved under both international and Pan-American copyright conventions. Any
copying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes
infringement under the Copyright Law of the United States.
The Principles of
Standardization
Notice
IPC Position
Statement on
Specication
Revision Change
Why is there
a charge for
this document?
In May 1995 the IPC’s Technical Activities Executive Committee (TAEC) adopted Principles of
Standardization as a guiding principle of IPC’s standardization efforts.
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Standards Should:
Show relationship to Design for Manufacturability
(DFM) and Design for the Environment (DFE)
Minimize time to market
Contain simple (simplied) language
Just include spec information
Focus on end product performance
Include a feedback system on use and
problems for future improvement
Standards Should Not:
Inhibit innovation
Increase time-to-market
Keep people out
Increase cycle time
Tell you how to make something
Contain anything that cannot be
defended with data
IPC-7526A
Developed by the Stencil Cleaning Task Group (5-31g) of the
Cleaning and Coating Committee (5-30)of IPC
Stencil and Misprinted
Board Cleaning Handbook
Supersedes:
IPC-7526 - February 2007
Users of this publication are encouraged to participate in the development
of future revisions.
Contact:
IPC
3000 Lakeside Drive, Suite 309S
Bannockburn, Illinois
60015-1219
Tel 847 615.7100
Fax 847 615.7105
摘要:

IPC 7526A-2022 是电子组装行业中关于模板(钢网)设计与验收的最新国际标准,由 IPC(国际电子工业联接协会)发布。该标准替代了旧版 IPC 7526,主要针对表面贴装技术(SMT)中的模板开孔设计、尺寸公差、材料选择及制造工艺提供了系统化的规范与指导。IPC 7526A 特别关注细间距元件、高密度互连(HDI)以及微型化封装对模板精度的要求,帮助生产厂商优化锡膏印刷质量,降低焊接缺陷,提升最终产品的可靠性与一致性。对于从事 SMT 工艺、PCB 组装和质量控制的工程师与管理者而言,

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作者:Carl 分类:国外协会 价格:30星币 属性:56 页 大小:16.31MB 格式:PDF 时间:2024-09-01

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