IPC D-317a-1995

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IPC-D-317A

Design Guidelines

for Electronic Packaging

Utilizing High-Speed

Techniques

IPC-D-317A

January 1995

NSTITUTE FOR

NTERCONNECTING

AND

ACKAGING

LECTRONIC

IRCUITS

A standard developed by the Institute for Interconnecting

and Packaging Electronic Circuits

2215 Sanders Road

Northbrook, Illinois

60062-6135

Tel

Fax

URL:

847 509.9700

847 509.9798

www.ipc.org

The Principles of

Standardization In May 1995 the IPC’s Technical Activities Executive Committee adopted Prin-

ciples of Standardization as a guiding principle of IPC’s standardization efforts.

Standards Should:

• Show relationship to DFM & DFE

• Minimize time to market

• Contain simple (simpliﬁed) language

• Just include spec information

• Focus on end product performance

• Include a feed back system on use and problems for future improvement

Standards Should Not:

• Inhibit innovation

• Increase time-to-market

• Keep people out

• Increase cycle time

• Tell you how to make something

• Contain anything that cannot be defended with data

Notice IPC Standards and Publications are designed to serve the public interest through

eliminating misunderstandings between manufacturers and purchasers, facilitat-

ing interchangeability and improvement of products, and assisting the pur-

chaser in selecting and obtaining with minimum delay the proper product for

his particular need. Existence of such Standards and Publications shall not

in any respect preclude any member or nonmember of IPC from manufacturing

or selling products not conforming to such Standards and Publication, nor

shall the existence of such Standards and Publications preclude their voluntary

use by those other than IPC members, whether the standard is to be used

either domestically or internationally.

Recommended Standards and Publications are adopted by IPC without regard to

whether their adoption may involve patents on articles, materials, or processes.

By such action, IPC does not assume any liability to any patent owner, nor

do they assume any obligation whatever to parties adopting the Recommended

Standard or Publication. Users are also wholly responsible for protecting

themselves against all claims of liabilities for patent infringement.

The material in this standard was developed by the IPC-D-317 Task Group

(D-21a) of the High Speed/High Frequency Committee (D-20) of the Institute

for Interconnecting and Packaging Electronic Circuits.

international and Pan-American copyright conventions.

Any copying, scanning or other reproduction of these materials without the prior

written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States.

IPC-D-317A

Design Guidelines

for Electronic Packaging

Utilizing High-Speed

Techniques

Developed by the IPC-D-317 Task Group (D-21a) of the High Speed/

High Frequency Committee (D-20) of the Institute for Interconnecting

and Packaging Electronic Circuits

Why is there a charge for this standard?

Your purchase of this document contributes to the ongoing development

of new and updated industry standards. Standards allow manufacturers,

customers, and suppliers to understand one another better. Standards

allow manufacturers greater efficiencies when they can set up their

processes to meet industry standards, allowing them to offer their

customers lower costs.

IPC spends hundreds of thousands of dollars annually to support IPC’s

volunteers in the standards development process. There are many

rounds of drafts sent out for review and the committees spend hundreds

of hours in review and development. IPC’s staff attends and participates

in committee activities, typesets and circulates document drafts, and

follows all necessary procedures to qualify for ANSI approval.

IPC’s membership dues have been kept low in order to allow as many

companies as possible to participate. Therefore, the standards revenue

is necessary to complement dues revenue. The price schedule offers a

50% discount to IPC members. If your company buys IPC standards,

why not take advantage of this and the many other beneﬁts of IPC

membership as well? For more information on membership in IPC,

please visit www.ipc.org or call 847/790-5372.

Thank you for your continued support.

Users of this standard are encouraged to participate in the

development of future revisions.

IPC

2215 Sanders Road

Northbrook, Illinois

60062-6135

Tel 847 509.9700

Fax 847 509.9798

NSTITUTE FOR

NTERCONNECTING

AND

ACKAGING

LECTRONIC

IRCUITS

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摘要：

IPC D-317a-1995 是美国电子电路互连与封装协会（IPC）发布的一项重要标准，专注于印刷电路板（PCB）设计中关于孔与焊盘之间间距（即孔破盘）的规范，尤其适用于高密度互连（HDI）和精密多层板设计。该标准为工程师提供了可量化的设计准则，包括最小环宽、孔位公差、焊盘尺寸以及不同制造工艺下的安全性要求，旨在避免因孔位偏移导致的电气连接失效或短路问题。尽管发布较早，D-317a 仍然是许多传统 PCB 设计及制造评估的基准参考，特别适用于军工、航空和汽车电子等对可靠性要求极高的领域。理解并

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IPC D-317a-1995

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