IPC HDBK-850-2012 电子印制板组件用灌封材料及封装工艺的设计、选择与应用指南

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IPC-HDBK-850

2012 - July

Guidelines for Design, Selection

and Application of Potting

Materials and Encapsulation

Processes Used for Electronics

Printed Circuit Board Assembly

A standard developed by IPC

Association Connecting Electronics Industries

The Principles of

Standardization

In May 1995 the IPC’s Technical Activities Executive Committee (TAEC) adopted Principles of

Standardization as a guiding principle of IPC’s standardization efforts.

Standards Should:

• Show relationship to Design for Manufacturability

(DFM) and Design for the Environment (DFE)

• Minimize time to market

• Contain simple (simpliﬁed) language

• Just include spec information

• Focus on end product performance

• Include a feedback system on use and

problems for future improvement

Standards Should Not:

• Inhibit innovation

• Increase time-to-market

• Keep people out

• Increase cycle time

• Tell you how to make something

• Contain anything that cannot

be defended with data

Notice IPC Standards and Publications are designed to serve the public interest through eliminating mis-

understandings between manufacturers and purchasers, facilitating interchangeability and improve-

ment of products, and assisting the purchaser in selecting and obtaining with minimum delay the

proper product for his particular need. Existence of such Standards and Publications shall not in

any respect preclude any member or nonmember of IPC from manufacturing or selling products

not conforming to such Standards and Publication, nor shall the existence of such Standards and

Publications preclude their voluntary use by those other than IPC members, whether the standard

is to be used either domestically or internationally.

Recommended Standards and Publications are adopted by IPC without regard to whether their adop-

tion may involve patents on articles, materials, or processes. By such action, IPC does not assume

any liability to any patent owner, nor do they assume any obligation whatever to parties adopting

the Recommended Standard or Publication. Users are also wholly responsible for protecting them-

selves against all claims of liabilities for patent infringement.

IPC Position

Statement on

Specification

Revision Change

It is the position of IPC’s Technical Activities Executive Committee that the use and implementation

of IPC publications is voluntary and is part of a relationship entered into by customer and supplier.

When an IPC publication is updated and a new revision is published, it is the opinion of the TAEC

that the use of the new revision as part of an existing relationship is not automatic unless required

by the contract. The TAEC recommends the use of the latest revision. Adopted October 6, 1998

Why is there

a charge for

this document?

Your purchase of this document contributes to the ongoing development of new and updated industry

standards and publications. Standards allow manufacturers, customers, and suppliers to understand

one another better. Standards allow manufacturers greater efficiencies when they can set up their

processes to meet industry standards, allowing them to offer their customers lower costs.

IPC spends hundreds of thousands of dollars annually to support IPC’s volunteers in the standards

and publications development process. There are many rounds of drafts sent out for review and

the committees spend hundreds of hours in review and development. IPC’s staff attends and par-

ticipates in committee activities, typesets and circulates document drafts, and follows all necessary

procedures to qualify for ANSI approval.

IPC’s membership dues have been kept low to allow as many companies as possible to participate.

Therefore, the standards and publications revenue is necessary to complement dues revenue. The

price schedule offers a 50% discount to IPC members. If your company buys IPC standards and

publications, why not take advantage of this and the many other beneﬁts of IPC membership as

well? For more information on membership in IPC, please visit www.ipc.org or call 847/597-2872.

Thank you for your continued support.

copying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and

constitutes infringement under the Copyright Law of the United States.

IPC-HDBK-850

Guidelines for Design,

Selection and Application

of Potting Materials and

Encapsulation Processes

Used for Electronics

Printed Circuit Board

Assembly

Developed by the Potting and Encapsulation Task Group (5-33f) of the

Cleaning and Coating Committee (5-30) of IPC

Users of this publication are encouraged to participate in the

development of future revisions.

Contact:

IPC

3000 Lakeside Drive, Suite 309S

Bannockburn, Illinois

60015-1249

Tel 847 615.7100

Fax 847 615.7105

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标签： #电子灌封工艺 #环氧树脂 #聚氨酯

摘要：

IPC-HDBK-850是电子灌封工艺的实用指南，指导灌封 / 封装材料（如环氧树脂、硅胶、聚氨酯等）的选型、设计、工艺参数、应用场景，解决灌封过程中的气泡、分层、固化不良、应力等问题，提升 PCBA 的防潮、防震、绝缘、散热性能，适用于汽车电子、工业控制、户外设备等对可靠性要求高的领域。

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IPC HDBK-850-2012 电子印制板组件用灌封材料及封装工艺的设计、选择与应用指南

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