IPC JPCA 4104-1999

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IPC/JPCA-4104

Speciﬁcation for High

Density Interconnect (HDI)

and Microvia Materials

ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES

2215 Sanders Road, Northbrook, IL 60062-6135

Tel. 847.509.9700 Fax 847.509.9798

www.ipc.org

IPC/JPCA-4104

May 1999 A standard developed by IPC and JPCA

The Principles of

Standardization In May 1995 the IPC’s Technical Activities Executive Committee adopted Principles of

Standardization as a guiding principle of IPC’s standardization efforts.

Standards Should:

• Show relationship to DFM & DFE

• Minimize time to market

• Contain simple (simpliﬁed) language

• Just include spec information

• Focus on end product performance

• Include a feedback system on use and problems for future improvement

Standards Should Not:

• Inhibit innovation

• Increase time-to-market

• Keep people out

• Increase cycle time

• Tell you how to make something

• Contain anything that cannot be defended with data

Notice IPC Standards and Publications are designed to serve the public interest through eliminating

misunderstandings between manufacturers and purchasers, facilitating interchangeability and

improvement of products, and assisting the purchaser in selecting and obtaining with minimum

delay the proper product for his particular need. Existence of such Standards and Publications

shall not in any respect preclude any member or nonmember of IPC from manufacturing or sell-

ing products not conforming to such Standards and Publication, nor shall the existence of such

Standards and Publications preclude their voluntary use by those other than IPC members,

whether the standard is to be used either domestically or internationally.

Recommended Standards and Publications are adopted by IPC without regard to whether their

adoption may involve patents on articles, materials, or processes. By such action, IPC does

not assume any liability to any patent owner, nor do they assume any obligation whatever to

parties adopting the Recommended Standard or Publication. Users are also wholly responsible

for protecting themselves against all claims of liabilities for patent infringement.

Why is there

a charge for

this standard?

Your purchase of this document contributes to the ongoing development of new and updated

industry standards. Standards allow manufacturers, customers, and suppliers to understand one

another better. Standards allow manufacturers greater efficiencies when they can set up their

processes to meet industry standards, allowing them to offer their customers lower costs.

IPC spends hundreds of thousands of dollars annually to support IPC’s volunteers in the

standards development process. There are many rounds of drafts sent out for review and

the committees spend hundreds of hours in review and development. IPC’s staff attends and

participates in committee activities, typesets and circulates document drafts, and follows all

necessary procedures to qualify for ANSI approval.

IPC’s membership dues have been kept low in order to allow as many companies as possible

to participate. Therefore, the standards revenue is necessary to complement dues revenue. The

price schedule offers a 50% discount to IPC members. If your company buys IPC standards, why

not take advantage of this and the many other beneﬁts of IPC membership as well? For more

information on membership in IPC, please visit www.ipc.org or call 847/790-5372.

Thank you for your continued support.

Any copying, scanning or other reproduction of these materials without the prior written consent of the copyright

holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States.

IPC/JPCA-4104

Specification for High

Density Interconnect (HDI)

and Microvia Materials

Developed by the Microvia/High Density Interconnect Materials

Subcommittee (D-42) of the High Density Interconnect (HDI)

Committee (D-40) of IPC and the Build-Up PWB Committee

of JPCA

Users of this standard are encouraged to participate in the

development of future revisions.

Contact:

IPC

2215 Sanders Road

Northbrook, Illinois

60062-6135

Tel 847 509.9700

Fax 847 509.9798

JPCA

2F, Kairo Kaikan

12-2, Nishiogikita 3-chome

Suginami-Ku, Tokyo 167-0042

Japan

Tel 011 81/3-5310-2020

Fax 011 81/3-5310-2021

ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES

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摘要：

IPC JPCA 4104-1999 是日本电子电路工业协会（JPCA）与国际电子工业联接协会（IPC）联合制定的一项关于印制板基材性能与验收规范的技术标准。该标准主要针对高密度互连（HDI）及高性能电子设备中使用的层压板与覆铜箔材料，规定了其电气、机械、热学及环境可靠性等关键指标。查阅此文档有助于电子制造企业在PCB选材、工艺控制及质量认证过程中明确国际通用的技术要求，确保产品满足1999版规范下的兼容性及长期使用稳定性。该标准为印制电路板行业提供了一套权威的测试方法与合格判定依据，尤其适用于

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IPC JPCA 4104-1999

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