IPC TP-1043-1992

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IPC-TP-1043

IPC Cleaning and

Cleanliness Test Program

Phase 3 Water Soluble

Fluxes Part 1

Douglas Pauls

Department Of The Navy

Naval Air Warfare Center

Indianapolis, IN

IPC 1992 Fall Meeting

October 12–15, 1992

Minneapolis, Minnesota

Presented at

Published by IPC

2215 Sanders Road

Northbrook, Illinois

60062-6135

Tel 847 509.9700

Fax 847 509.9798

ECHNICAL

APER

ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES

IPC-TP-1043

IPC Cleaning and

Cleanliness Test Program

Phase 3 Water Soluble

Fluxes Part 1: B-24

Interactions of Water

Soluble Fluxes with

Printed Wiring Board

Substrates/Metallizations

September 30, 1992

A joint program sponsored by the EPA/DOD/IPC/Industry Ad Hoc

Solvents Working Group. This evaluation was performed at the

Naval Air Warfare Center, Aircraft Division, Indianapolis, Indiana.

IPC

2215 Sanders Road

Northbrook, Illinois

60062-6135

Tel 847 509.9700

Fax 847 509.9798

ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES

Table of Contents

1 Overview ................................................................... 1

2 Equipment ................................................................ 1

2.1 Wave Solder Equipment and Parameters ............. 1

2.2 Aqueous Cleaning Equipment and Parameters .... 2

2.3 Solder Paste Application Equipment and

Parameters ............................................................. 2

2.4 Infrared Reﬂow Equipment and Parameters ........ 2

2.5 Ionic Cleanliness Test Equipment

and Parameters ...................................................... 2

2.6 Ion Chromatography Equipment

and Parameters ...................................................... 3

2.7 High Pressure Liquid Chromatography

(HPLC) Equipment and Parameters ..................... 3

2.8 Surface Insulation Resistance (SIR)

Equipment and Parameters ................................... 3

2.9 Other Equipment and Materials ........................... 4

3 Developmental Work ............................................... 4

3.1 Test Plan Development ......................................... 4

3.2 Sample Sizes ......................................................... 4

3.3 Test Vehicle Development .................................... 5

3.4 Test-Site Process Development ............................ 5

3.5 Materials Characterization .................................... 6

3.6 Process Documentation ......................................... 6

3.7 Test Board Inspection ........................................... 6

3.8 Test Board Preparation ......................................... 7

3.8.1 Oven Bake ............................................................. 7

3.8.2 Microetch Process ................................................. 7

3.8.3 IPA/Water Clean .................................................... 8

3.8.4 Board Drying ........................................................ 8

3.9 Formulations Tested .............................................. 8

3.10 Other Developmental Work .................................. 8

3.11 Dry Run ................................................................. 8

3.12 NAWC Personnel .................................................. 9

4 Test Procedure ........................................................ 9

4.1 Test Monitoring and Validation Team (TMVT) .. 9

4.2 Board Handling ..................................................... 9

4.3 Wave Solder Operations ..................................... 10

4.4 Aqueous Cleaning ............................................... 10

4.5 Transport ............................................................. 10

4.6 Board Sorting ...................................................... 10

4.7 Solder Paste Printing ........................................... 11

4.8 Infrared (IR) Reﬂow ........................................... 11

4.9 Ionic Cleanliness Tests ........................................ 11

4.10 Ion Chromatography (IC) and HPLC Tests ....... 12

4.11 SIR Tests ............................................................. 13

5 Test Results ........................................................... 13

5.1 Results from Dry Run (Uncleaned Boards) ....... 14

5.2 Ionic Cleanliness by Omegameter 600SMD

(Cleaned) ............................................................. 14

5.3 Ion Chromatography Results .............................. 15

5.4 High Pressure Liquid Chromatography

Results ................................................................. 16

5.5 Surface Insulation Resistance (SIR) Test

Results - Numerical ............................................ 17

5.6 SIR Results - Visual Observations ..................... 20

5.7 Ranking of Processing Characteristics ............... 21

5.8 Selection Criteria for B-36 Test (Part 2) ........... 21

6 Interim SIR Tests ................................................... 21

6.1 Effects of Cleaning Time Delay ......................... 22

6.2 Effects of Various Extractions ............................ 23

6.3 Effects of Alternate SIR Temperature/

Humidity Proﬁle .................................................. 27

7 Interim Analytical Work ........................................ 28

7.1 Analysis at NAWC ............................................. 28

7.2 Analysis at Alliant Techsystems ......................... 28

7.3 Analysis at Rome laboratory

(formerly RADC) ................................................ 29

7.4 Conclusions of the Interim Analytical Work ..... 29

8 Conclusions ........................................................... 29

8.1 Conclusions from the Cleanliness Testing ......... 29

8.2 Answers to Interim Questions ............................ 30

8.3 Conclusions from the SIR Testing ..................... 30

10 Appendix A: Process Instructions .................. 33

11 Appendix B: Thermal Proﬁles ......................... 41

12 Appendix C: Sample Traveler Sheets ............... 44

13 Appendix D: Ion Chromatography Analysis

of Fluxed Circuit Boards .................................... 47

14 Appendix E: HPLC Procedures ......................... 48

15 Appendix F: List of Contacts ............................ 51

16 Appendix G: References .................................. 52

September 1992 IPC-TP-1043

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摘要：

IPC TP-1043-1992 是 IPC 协会发布的一份技术规范，主要针对表面贴装技术（SMT）中的焊接工艺提供指导。该标准涵盖了焊膏印刷、元件贴装、回流焊接过程中的关键参数与质量控制方法，适用于电子组装行业的生产与检验环节。尽管发布时间较早，但其中关于工艺窗口、缺陷预防和可靠性测试的原则仍对现代高密度互连板与无铅焊接工艺具有重要参考价值。相关技术人员在制定 SMT 产线工艺规范或进行焊接工艺认证时，可依据 IPC TP-1043-1992 中的核心条款优化操作流程，提升产品良率与长期可靠性

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