IPC D-279-1996

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IPC-D-279

Design Guidelines for Reliable

Surface Mount Technology

Printed Board Assemblies

IPC-D-279

July 1996

The Institute for

Interconnecting

and Packaging

Electronic Circuits

2215 Sanders Road

Northbrook, Illinois

60062-6135

Tel

Fax

URL:

847 509.9700

847 509.9798

http://www.ipc.org

The Principles of

Standardization In May 1995 the IPC’s Technical Activities Executive Committee adopted Prin-

ciples of Standardization as a guiding principle of IPC’s standardization efforts

Standards Should:

• Show relationship to DFM & DFE

• Minimize time to market

• Contain simple (simpliﬁed) language

• Just include spec information

• Focus on end product performance

• Include a feed back system on use and problems for future improvement

Standards Should Not:

• Inhibit innovation

• Increase time-to-market

• Keep people out

• Increase cycle time

• Tell you how to make something

• Contain anything that cannot be defended with data

Notice IPC Standards and Publications are designed to serve the public interest through

eliminating misunderstandings between manufacturers and purchasers, facilitat-

ing interchangeability and improvement of products, and assisting the pur-

chaser in selecting and obtaining with minimum delay the proper product for

his particular need. Existence of such Standards and Publications shall not

in any respect preclude any member or nonmember of IPC from manufacturing

or selling products not conforming to such Standards and Publication, nor

shall the existence of such Standards and Publications preclude their voluntary

use by those other than IPC members, whether the standard is to be used

either domestically or internationally.

Recommended Standards and Publications are adopted by IPC without regard to

whether their adoption may involve patents on articles, materials, or processes.

By such action, IPC does not assume any liability to any patent owner, nor

do they assume any obligation whatever to parties adopting the Recommended

Standard or Publication. Users are also wholly responsible for protecting

themselves against all claims of liabilities for patent infringement.

The material in this standard was developed by the IPC SMT Design Reliability

Task Group (6-10b) of the Product Reliability Committee (6-10) of the Institute

for Interconnecting and Packaging Electronic Circuits.

United States of America.

No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission

of the publisher.

IPC-D-279

Design Guidelines for

Reliable Surface Mount

Technology Printed Board

Assemblies

Developed by the SMT Design Reliability Task Group (6-10b)

of the Product Reliability Committee (6-10) of the Institute for

Interconnecting and Packaging Electronic Circuits

Users of this standard are encouraged to participate in the

development of future revisions.

Contact:

IPC

2215 Sanders Road

Northbrook, Illinois

60062-6135

Tel 847 509.9700

Fax 847 509.9798

NSTITUTE FOR

NTERCONNECTING

AND

ACKAGING

LECTRONIC

IRCUITS

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摘要：

《IPC D-279-1996》是电子组装行业关于热应力测试与焊点可靠性评估的关键标准规范。该文档定义了适用于表面贴装和通孔组件的温度循环、热冲击及振动测试方法，旨在通过加速老化实验验证焊点在极端温度变化下的机械完整性与电连接稳定性。标准详细规定了测试样品准备、温度剖面参数（如-40°C至+125°C的典型范围）、循环次数及失效判定准则，尤其重点关注无铅焊料和含铅焊料在不同工艺界面上的应力分布。对于从事航空航天、汽车电子或高可靠性设备的设计与质量工程师而言，遵循IPC D-279-1996可有效

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IPC D-279-1996

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