JIS C5070-2009 表面安装技术.第2部分表面安装器件(SMD)的运输和存储条件.使用指南

VIP免费
standardshare 2026-01-05 17 493.73KB 13 页 15星币
侵权投诉
JAPANESE
INDUSTRIAL
STANDARD
Translated
and
Published
by
Japanese
Standards
Association
JIS C 5070
:2009
(lEe
61760-2 : 2007)
(JElTA)
Surface
mounting
technology-
Part
2:
Transportation
and
storage
conditions
of
surface
mounting
devices
(SMD}-Application
guide
ICS
31.240
Reference
number
:
JIS
C
5070
:
2009
(E)
PROTECTED
BY
COPYRIGHT
7S
C
5070
:
2009
(lEC
61760-2
:
2007)
Date
of
Establishment:
2002-03-20
Date
of
Revision:
2009-12-21
Date
of
Public
Notice
in
Official
Gazette:
2009-12-21
Investigated
by:
Japanese
Industrial
Standards
Committee
© JSA 2010
Standards
Board
Technical
Committee
on
Electronics
Technology
JIS C
5070:
2009,
First
English
edition
published
in
2010-05
Translated
and
published
by:
Japanese
Standards
Association
4-1-24,
Akasaka,
Minato-ku,
Tokyo,
107-8440
JAPAN
In
the
event
of
any
doubts
arising
as
to
the
contents,
the
original
JIS is
to
be
the
final
authority.
All
rights
reserved.
Unless
otherwise
specified,
no
part
of
this
publication
may
be
reproduced
or
utilized
in
any
form
or
by
any
means,
electronic
or
mechanical,
including
photocopying
and
microfilm,
without
permission
in
writing
from
the
publisher.
Printed
in
Japan
AT
PROTECTED
BY
COPYRIGHT
C
5070
: 2009
(lEC
61760-2 : 2007)
Contents
Page
Introduction·········································· ...................................................... ·························1
1
Scope
and
object
...................................................... ··················································1
2
Normative
references
...................................................... ··········································1
3
General
conditions
..................................................................................................... 2
4
Transportation
conditions
...................................................... ··································3
4.1
General
transportation
conditions
...................................................... ····················3
4.2
Specific
transportation
conditions
........................................................................... 3
5
Storage
conditions
..................................................................................................... 3
6
Related
issues
............................................................................................................ 4
Annex
A
(informative)
Table
of
environmental
conditions
and
description
of
classes························································································5
(i)
PROTECTED
BY
COPYRIGHT

标签： #安装

摘要：

本文档为JIS C5070-2009标准规范，全称为《表面安装技术 第2部分：表面安装器件（SMD）的运输和存储条件 使用指南》。该标准主要针对表面安装技术中使用的表面安装器件（SMD），详细规定了其从出厂到投入使用前的运输和存储环境条件、包装要求、防潮控制措施以及操作注意事项。内容涵盖湿度敏感等级（MSL）管理、干燥包装方法、开封后使用期限、防静电保护等关键技术指标，旨在帮助电子制造企业、仓储物流人员和工艺工程师有效避免SMD因湿气、振动、温差或静电极化导致的品质劣化或焊接缺陷。遵循本指南可显

展开>> 收起<<
JIS C5070-2009 表面安装技术.第2部分表面安装器件(SMD)的运输和存储条件.使用指南.pdf

共13页,预览3页

还剩页未读， 继续阅读

声明：本文档系会员上传，若文档所含内容侵犯了您的版权或隐私，请立即通知，我们立即给予侵权申诉删除！

相关推荐

更多
立即下载
作者：standar... 分类：国际标准 价格：15星币 属性：13 页 大小：493.73KB 格式：PDF 时间：2026-01-05

开通VIP享超值会员特权

  • 多端同步记录
  • 高速下载文档
  • 免费文档工具
  • 分享文档赚钱
  • 每日登录抽奖
  • 优质衍生服务

相关内容

更多

热门标签

ISO 混凝土 技术规范 检验 航空航天 不锈钢 消防 压力容器 铝合金 法兰
/ 13
评分 收藏
分享
立即下载 VIP免费下载
客服
关注